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Panasonic SMT Chip Mounter NPM-W2

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Negotiable
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Delivery term:
The date of payment from buyers deliver within days
seat:
Guangdong
Validity to:
Long-term effective
Last update:
2020-03-28 00:55
Browse the number:
173

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Company Profile

SFG Electronic Technology Co., Limited

By certification [File Integrity]

Contact：songhuijd(Mr.)

Email：

Telephone：

Phone：

Area：Guangdong

Address：Guangdong

Website：http://www.sfgsmt.com/ http://songhuijd.ykdtplastic.com/

PRODUCT DETAILS

Specification

Model ID	NPM-W2
Rear head Front head	Lightweight 16-nozzle head	12-nozzle head	Lightweight 8-nozzle head	3-nozzle head V2	Dispensing head	No head
Lightweight 16-nozzle head	NM-EJM7D				NM-EJM7D-MD	NM-EJM7D
12-nozzle head					NM-EJM7D-MD
Lightweight 8-nozzle head
3-nozzle head V2
Dispensing head	NM-EJM7D-MD					NM-EJM7D-D
Inspection head	NM-EJM7D-MA					NM-EJM7D-A
No head	NM-EJM7D				NM-EJM7D-D

PCB dimensions (mm)	Single-lane*1	Batch mounting	L 50 x W 50 ~ L 750 x W 550
		2-positin mounting	L 50 x W 50 ~ L 350 x W 550
	Dual-lane*1	Dual transfer (Batch)	L 50 × W 50 ~ L 750 × W 260
		Dual transfer (2-positin)	L 50 × W 50 ~ L 350 × W 260
		Single transfer (Batch)	L 50 × W 50 ~ L 750 × W 510
		Single transfer (2-positin)	L 50 × W 50 ~ L 350 × W 510
Electric source			3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA
Pneumatic source *2			0.5 MPa, 200 L /min (A.N.R.)
Dimensions *2 (mm)			W 1 2803 × D 2 332 4 × H 1 444 *5
Mass			2 470 kg (Only for main body : This differs depending on the option configuration.)

Placement head		Lightweight 16-nozzle head(Per head)		12-nozzle head (Per head)		Lightweight 8-nozzle head (Per head)	3-nozzle head V2 (Per head)
		High production mode[ON]	High production mode[OFF]	High production mode[ON]	High production mode[OFF]
Max. peed		38 500cph (0.094 s/ chip)	35 000cph (0.103 s/ chip)	32 250cph (0.112 s/ chip)	31 250cph (0.115 s/ chip)	20 800cph (0.173 s/ chip)	8 320cph (0.433 s/ chip) 6 500cph (0.554 s/ QFP)
Placement accuracy (Cpk□1)		±40 μm / chip	±30 μm / chip (±25μm / chip)*6	±40 μm / chip	±30 μm / chip	± 30 µm/chip ± 30 µm/QFP □12mm to □32mm ± 50 µm/QFP □12mm Under	± 30 µm/QFP
Component dimensions (mm)		0402*7 chip ~ L 6 x W 6 x T 3	030157 8/0402*7 chip ~ L 6 x W 6 x T 3	0402*7 chip ~ L 12 x W 12 x T 6.5		0402*7 chip ~ L 32 x W 32 x T 12	0603 chip to L 150 x W 25 (diagonal152) x T 30
Component supply	Taping	Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm				Tape : 4 to 56 mm	ape : 4 to 56 / 72 / 88 / 104 mm
		Max.120 (Tape: 4, 8 mm)				Front/rear feeder cart specifications : Max.120 ( Tape width and feeder are subject to the conditions on the left) Single tray specifications : Max.86 ( Tape width and feeder are subject to the conditions on the left) Twin tray specifications : Max.60 ( Tape width and feeder are subject to the conditions on the left)
	Stick					Front/rear feeder cart specifications : Max.30 (Single stick feeder) Single tray specifications : Max.21 (Single stick feeder) Twin tray specifications : Max.15 (Single stick feeder)
	Tray					Single tray specifications : Max.20 Twin tray specifications : Max.40

Dispensing head	Dot dispensing	Draw dispensing
Dispensing speed	0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation	4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9
Adhesive position accuracy (Cpk□1)	± 75 μ m /dot	± 100 μ m /component
Applicable components	1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP	BGA, CSP

Inspection head		2D inspection head (A)	2D inspection head (B)
Resolution		18 µm	9 µm
View size (mm)		44.4 x 37.2	21.1 x 17.6
Inspection processing time	Solder Inspection *10	0.35s/ View size
	Component Inspection *10	0.5s/ View size
Inspection object	Solder Inspection *10	Chip component : 100 μm × 150 μm or more (0603 or more) Package component : φ150 μm or more	Chip component : 80 μm × 120 μm or more (0402 or more) Package component : φ120 μm or more
	Component Inspection *10	Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11	Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11
Inspection items	Solder Inspection *10	Oozing, blur, misalignment, abnormal shape, bridging
	Component Inspection *10	Missing, shift, flipping, polarity, foreign object inspection *12
Inspection position accuracy *13( Cpk□1)		± 20 μm	± 10 μm
No. of inspection	Solder Inspection *10	Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
	Component Inspection *10	Max. 10 000 pcs./machine

*1	:	Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.
*2	:	Only for main body
*3	:	1 880 mm in width if extension conveyors (300 mm) are placed on both sides.
*4	:	Dimension D including tray feeder : 2 570 mm Dimension D including feeder cart : 2 465 mm
*5	:	Excluding the monitor, signal tower and ceiling fan cover.
*6	:	±25 μm placement support option.(Under conditions specified by PSFS)
*7	:	The 03015/0402 chip requires a specific nozzle/feeder.
*8	:	Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)
*9	:	A PCB height measurement time of 0.5s is included.
*10	:	One head cannot handle solder inspection and component inspection at the same time.
*11	:	Please refer to the specification booklet for details.
*12	:	Foreign object is available to chip components.(Excluding 03015 mm chip)
*13	:	This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions.

*Please refer to the specification booklet for details.

http://www.sfgsmt.com/

Panasonic SMT Chip Mounter NPM-W2

PRODUCT DETAILS

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